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tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 1 toshiba led lamps tlrmv1020(t14), tlsv1020(t14), tlov1020(t14), tlyv1020(t14), tlgv1020(t14), tlpgv1020(t14) panel circuit indicator surface-mount devices 1.6 (l) 0.8 (w) 0.6 (h) mm ingaa ? p leds high luminous intensity and low power consumption drive current conditions: 2 ma and 5 ma 2-ma drive: general backlighting 5-ma drive: high-brightness applications suitable for backlighting colors: red, orange, yellow, green, pure green standard embossed tape packing 4-mm pitch: t14 (4000/reel) applications: backlighting (mobile phones, lcd displays, switching displays) indicators for compact devices and battery-driven devices etc. color and material maximum ratings (ta 25c) product name forward current i f (ma) reverse voltage v r (v) power dissipation p d (mw) operating temperature t opr (c) storage temperature t stg (c) tlrmv1020 tlsv1020 tlov1020 tlyv1020 tlgv1020 tlpgv1020 15 4 34.5 40~100 40~100 unit: mm jedec D jeita D toshiba D weight: 0.001 g (typ.) product name color material tlrmv1020 red tlsv1020 red tlov1020 orange tlyv1020 yellow tlgv1020 green tlpgv1020 pure green ingaa ? p
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 2 electrical characteristics (ta 25c) forward voltage v f reverse current i r product name min typ. max i f max v r tlrmv1020 2.0 2.3 tlsv1020 2.0 2.3 tlov1020 2.0 2.3 tlyv1020 2.0 2.3 tlgv1020 2.0 2.3 tlpgv1020 2.0 2.3 5 10 4 unit v ma a v optical characteristics?1 (ta 25c) luminous intensity specifications are given for both 2-ma-drive devices and 5-ma-drive devices. 2-ma-drive devices are used in low-power-consumption applications. their product numbers have the suffix ?2ma?, as shown below. standard specification (5-ma type): tl v1020(t14) ?2ma? specification (2-ma type): tl v1020(t14, 2ma ) (1) standard specification (5 ma) (2) 2ma specification (2 ma) luminous intensity i v luminous intensity i v product name min typ. max i f product name min typ. max i f tlrmv1020 4.76 15 tlrmv1020 2.72 6 tlsv1020 8.5 30 tlsv1020 4.76 12 tlov1020 8.5 38 tlov1020 4.76 14 tlyv1020 8.5 25 tlyv1020 4.76 9 tlgv1020 4.76 14 tlgv1020 2.72 7 tlpgv1020 1.53 3.5 5 tlpgv1020 0.85 1.5 2 unit mcd ma unit mcd ma optical characteristics?2 (ta 25c) emission spectrum peak emission wavelength p dominant wavelength d product name min typ. max typ. min typ. max i f tlrmv1020 636 17 626 tlsv1020 623 17 613 tlov1020 612 15 605 tlyv1020 590 13 587 tlgv1020 574 11 571 tlpgv1020 562 11 558 5 unit nm nm nm ma note: the visible led lamp also emits some ir light. if a photodetector is located near the led lamp, please ensure that it will not be affected by the ir light.
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 3 tlrmv1020 allowable forward current i f (ma) relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength ambient temperature ta (c) i f ? ta 0 580 600 620 640 660 680 700 0.2 0.4 0.6 0.8 1.0 i f 20 ma ta 25c 0 0 20 40 60 80 100 120 5 10 15 20 25 30 1 1.6 10 100 1.8 2.0 2.2 2.4 2.6 30 50 3 5 1 1 10 100 10 100 3 5 30 50 30 50 3 5 0.1 40 1 10 20 0 20 40 60 80 100 3 5 0.3 0.5
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 4 tlsv1020 allowable forward current i f (ma) relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength ambient temperature ta (c) i f ? ta 0 580 600 620 640 660 680 700 0.2 0.4 0.6 0.8 1.0 i f 20 ma ta 25c 0 0 20 40 60 80 100 120 5 10 15 20 25 30 1 1.6 10 100 1.8 2.0 2.2 2.4 2.6 30 50 3 5 1 1 10 100 10 100 3 5 30 50 30 50 3 5 0.1 40 1 10 20 0 20 40 60 80 100 3 5 0.3 0.5
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 5 tlov1020 allowable forward current i f (ma) relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength ambient temperature ta (c) i f ? ta 0 540 560 580 600 620 640 660 0.2 0.4 0.6 0.8 1.0 i f 20 ma ta 25c 0 0 20 40 60 80 100 120 5 10 15 20 25 30 1 1.6 10 100 1.8 2.0 2.2 2.4 2.6 30 50 3 5 3 1 10 100 10 100 300 5 50 30 30 50 3 5 0.1 40 1 10 20 0 20 40 60 80 100 3 5 0.3 0.5
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 6 tlyv1020 allowable forward current i f (ma) relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength ambient temperature ta (c) i f ? ta 0 540 560 580 600 620 640 660 0.2 0.4 0.6 0.8 1.0 i f 20 ma ta 25c 0 0 20 40 60 80 100 120 5 10 15 20 25 30 1 1.6 10 100 1.8 2.0 2.2 2.4 2.6 30 50 3 5 1 1 10 100 10 100 3 5 30 50 30 50 3 5 0.1 40 1 10 20 0 20 40 60 80 100 3 5 0.3 0.5
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 7 tlgv1020 allowable forward current i f (ma) relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength ambient temperature ta (c) i f ? ta 0 540 560 580 600 620 0.2 0.4 0.6 0.8 1.0 i f 20 ma ta 25c 0 0 20 40 60 80 100 120 5 10 15 20 25 30 1 1.6 10 100 1.8 2.0 2.2 2.4 2.6 30 50 3 5 1 1 10 100 10 100 3 5 30 50 30 50 3 5 0.1 40 1 10 20 0 20 40 60 80 100 3 5 0.3 0.5
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 8 tlpgv1020 allowable forward current i f (ma) relative luminous intensity forward voltage v f (v) i f ? v f forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength ambient temperature ta (c) i f ? ta 0 520 540 560 580 600 0.2 0.4 0.6 0.8 1.0 i f 20 ma ta 25c 0 0 20 40 60 80 100 120 5 10 15 20 25 30 1 1.6 10 100 1.8 2.0 2.2 2.4 2.6 30 50 3 5 0.1 40 1 10 20 0 20 40 60 80 100 3 5 0.3 0.5 1 1 10 100 10 3 5 30 3 5 30 50
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 9 radiation pattern vertical to polarity horizontal to polarity 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 30 0 60 90 90 30 60 1.0 0.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 10 packaging these led devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. the optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. this moisture proof bag may be stored unopened within 12 months at the following conditions. temperature: 5 c~30 c humidity: 90% (max) 2. after opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5c to 30c/60% rh or below. 3. if upon opening, the moisture indicator card shows humidity 30% or above (color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. after baking, use the baked devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 12 to 24 hours. expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. if the packing material of laminate would be broken, the airtightness would deteriorate. therefore, do not throw or drop the packed devices. mounting method soldering reflow soldering please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. second reflow soldering in case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 c, 60% rh max do not perform flow soldering. make any necessary soldering corrections manually. (only once at each soldering point) soldering iron : 25 w temperature : 300 c or less time : within 3 s note: temperature profile for soldering using pb-free solder. however, please note that this product?s leads are using pb, because they have plated with solder. as of september 2001, toshiba has begun to develop products intended for pb-free soldering. 60~120 s 10 s max 240 c max 4 c/s max 140~160 c 4 c/s max time (s) package surface temperature ( c) temperature profile time (s) package surface temperature ( c) recommended temperature profile for pb-free soldering 150~180 c 4 c/s max 5 s max 260 c max 4 c/s max 30~50 s 230 c 60~120 s (note)
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 11 recommended soldering pattern cleaning when cleaning after soldering is required, toshiba recommends the following conditions: soldering iron : less than 225w temperature : lower than 300 c time : within 3 s (up to 1 time per place) precaution when mounting do not apply force to the plastic part of the led under high-temperature conditions. to avoid damaging the led plastic do not apply friction using hard materials. when installing the pcb in a product, ensure that the device does not came into contact with other cmponents. tape specifications 1. product number format the type of package used for shipment is denoted by a symbol suffix after the product number. the method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard toshiba specifications) (1) tape type: t14 (4-mm pitch) (2) example 2. handling precautions tape material protected against static electricity. however, static electricity may occur depending on quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when peeling a tape cover. (a) since tape materials may accumulate an electrostatic charge, use an ionizer to neutralize the ambient air. (b) for transport and temporary storage of devices, use containers (boxes and bags) and jigs that are made of anti-static materials or of materials which dissipate electrostatic charge. tlsv1020 (t14) tape type toshiba product no. 0.7 0.9 0.8 (unit: mm) 2.3 0.3 0.25
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 12 3. tape dimensions (unit: mm) item symbol value tolerance item symbol value tolerance width w 8.0 0.2 b 1 1.85 0.05 carrier tape thickness t 1 0.2 0.05 length b 1.3 0.05 diameter d 0 1.55 0.1 a 0.9 0.05 pitch p 0 4.0 0.1 width a 1 0.4 0.05 feed hole position e 1.75 0.1 t 2 (0.85) vertical direction (1) p 1 4.0 0.1 depth t 3 0.7 0.05 vertical direction (2) p 2 2.0 0.1 cavity diameter of mark hole d 1 0.5 0.1 distance form center line horizontal direction f 3.5 0.1 p 0 d 0 x ? b b 1 w p 2 d 1 p 1 y y? x e f x ? x a 1 a y t 1 y? t 3 t 2 polarity
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 13 4. reel dimensions unit: mm 5. leader and trailer section of tape note 1: empty trailer section note 2: empty leader section 2 0.5 13 0.5 21 0.8 11.4 1 9 0.3 60 180
0 4 (note 1) leading part 190 mm (min) 40 mm or more (note 2) 40 mm or more
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 14 6. packing display (1) packing quantity reel 4,000 pcs carton 20,000 pcs (2) package form: each reel is sealed in an aluminum pack with silica gel. 7. label format (1) example: tlsv1020 (t14) p/n: type tlsv1020 add.c (t14) q?ty 4,000 pcs note lot number (rank symbol) (2) label location tape feel direction label position label position reel carton the aluminum package in which the reel is supplied also has a copy of the label attached to center of one side.
tl(rmv,sv,ov,yv,gv,pgv)1020(t14) 2001-12-05 15 toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc.. the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. gallium arsenide (gaas) is a substance used in the products described in this document. gaas dust and fumes are toxic. do not break, cut or pulverize the product, or use chemicals to dissolve them. when disposing of the products, follow the appropriate regulations. do not dispose of the products with other industrial waste or with domestic garbage. the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others. the information contained herein is subject to change without notice. 000707eac restrictions on product use

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